Hp Silicone Thermal Paste 100G, Thermal Paste 1.5 W/Mk, Silicone Thermopaste, Hp Cooling Paste, Hp Thermopaste

HP Silicone Thermal Conductive Paste is a flexible, white paste that ensures effective heat dissipation in electronic and electrical devices.

Advantages and unique features

• High thermal conductivity ≥ 1.5 W/mK for optimal cooling

• Resistance to a wide temperature range from -50 °C to 250 °C

• Non-conductive - full safety of electronic systems

• Resistance to moisture, oxidation, acids, alkalis, salts, SO₂ and ammonia

• Flexible, non-flowing consistency for easy application

Properties and applications

• Appearance: white paste with a density of ~2.1 g/cm³ (20 °C)

• Thermal impedance: < 0.227 °C in²/W

• Operating range: from −50 °C to 250 °C

• No air saturation: low evaporation (0.001 %) and bleeding (0.05 %)

• Application: modules with high conductivity coefficient, CPU/GPU cooling systems, LED diodes, HDD/SSD, consumer electronics, air conditioners, automotive electronics

Parameter | Value

Thermal conductivity | ≥ 1.5 W/mK

Density (20 °C) | ~ 2.1 g/cm³

Operating temperature range | −50 °C … 250 °C

Thermal impedance | < 0.227 °C in²/W

Evaporation | 0.001 %

Bleeding | 0.05 %

Tixotropic index | 380 ± 10

Dielectric permittivity εr | 7.2 – 7.7

Shelf life | 3 years

Store in a tightly closed container in a dry, cool and well-ventilated place, away from direct sunlight.

Color: nan Size: 100g